Yi-Chun Lin
Yi-Chun LinPh.D.Taiwan
Laser Materials Processing

Silicon Carbide Laser Cleaning Settings

When laser cleaning silicon carbide, watch out for its extreme hardness right from the start. I've seen this tough ceramic resist contaminants well, but it can crack if you push too hard with the laser. So, begin with gentler settings to avoid surface damage, like lower power and slower passes that let the heat spread evenly. This works best because silicon carbide conducts heat so efficiently, pulling energy away quickly without overheating spots. You'll find it different from softer metals—its low expansion under heat means less warping, so you can clean without distorting precision parts in aerospace or electronics. Tends to absorb laser energy deeply, which clears tough buildup effectively. Just keep passes overlapping a bit to cover everything, and monitor for any subtle discoloration that signals overdoing it. In my experience, this approach keeps the material's strength intact for high-heat applications.

Silicon Carbide Laser Cleaning Settings

Power Range

100
W
1
100
120

Wavelength

1,064
nm
355
1,064
1.1e4

Spot Size

50
μm
0.1
50
500

Repetition Rate

50
kHz
1
50
200

Fluence Threshold

2.5
J/cm²
0.3
2.5
4.5

Pulse Width

10
ns
0.1
10
1,000

Scan Speed

500
mm/s
10
500
5,000

Pass Count

3
passes
1
3
10

Overlap Ratio

50
%
10
50
90

Silicon Carbide Machine Settings

Power Range

100
W
1
100
120

Wavelength

1,064
nm
355
1,064
1.1e4

Spot Size

50
μm
0.1
50
500

Repetition Rate

50
kHz
1
50
200

Fluence Threshold

2.5
J/cm²
0.3
2.5
4.5

Pulse Width

10
ns
0.1
10
1,000

Scan Speed

500
mm/s
10
500
5,000

Pass Count

3
passes
1
3
10

Overlap Ratio

50
%
10
50
90

Silicon Carbide Material Safety

Shows damage risk across parameter space. Green = safe, Red = damage danger.

DANGER
Fluence:101.86 J/cm²
From optimal:71%
Pulse Duration (ns)
1000
750
500
250
0
1
21
41
61
80
100
120
Power (W)

Silicon Carbide Energy Coupling

Shows laser energy transfer efficiency. Green = high coupling (energy absorbed), Red = poor coupling (energy reflected).

GOOD
Fluence: J/cm²
From optimal:33%
Pulse Duration (ns)
1000
750
500
250
0
1
21
41
61
80
100
120
Power (W)

Silicon Carbide Thermal Stress Risk

Shows thermal stress and distortion risk. Green = low stress risk, Red = high stress/warping/cracking risk.

HIGH RISK
Fluence: J/cm²
From optimal:63%
Pulse Duration (ns)
1000
750
500
250
0
1
21
41
61
80
100
120
Power (W)

Silicon Carbide Cleaning Efficiency

Shows cleaning performance across parameter space. Green = optimal effectiveness, Red = ineffective.

GOOD
Fluence:101.86 J/cm²
From optimal:33%
Pulse Duration (ns)
1000
750
500
250
0
1
21
41
61
80
100
120
Power (W)

Silicon Carbide Heat Buildup

See if your multi-pass cleaning will overheat and damage the material

Safe

Heat Safety

Heat Control

Cooling Efficiency

Pass Optimization

📈 Heat Profile

Safe (<150°C)
Damage (>250°C)
0°C100°C200°C300°C✓ Safe🚨 Damage20°CPass 1Pass 2Pass 3

🔧 Laser Settings

Pulse Energy:2000.00 mJ
Total Sim Time:90.6s

🌡️ Live Temperature

20°C
✅ Safe
Pass 1 of 3
Time: 0.0s / 90.6s

▶️ Simulation Controls

Diagnostic & Prevention Center

Proactive strategies and reactive solutions for silicon carbide

🌡️thermal management

Heat accumulation

Impact: Excessive heat can damage substrate or alter material properties

Solutions:

  • Reduce repetition rate
  • Increase scan speed
  • Add cooling time between passes

Prevention: Monitor surface temperature and adjust parameters accordingly

🔍surface characteristics

Variable surface roughness

Impact: Inconsistent cleaning results across different surface textures

Solutions:

  • Adjust energy density based on surface condition
  • Use multiple passes with progressive settings
  • Pre-characterize surface before cleaning

Prevention: Standardize surface preparation procedures

Silicon Carbide Dataset Download

License: Creative Commons BY 4.0 • Free to use with attribution •Learn more

Parameter Relationships

Shows how changing one parameter physically affects others. Click any node to see its downstream impacts and role.

PowerRangeWavelengthSpotSizeRepetitionRateFluenceThresholdPulseWidthScanSpeedPassCountOverlapRatio

Power Range

Amplifies damage risk in Pulse Width. Keep low to maintain safety margins.

Spot Size

Same power in a smaller spot creates much higher energy density.

Pulse Width

More power means higher peak intensity. Too much can damage the material.

Pass Count

Using more passes means you can use lower power and still get the job done.