Silicon Nitride surface undergoing laser cleaning showing precise contamination removal
Yi-Chun Lin
Yi-Chun LinPh.D.Taiwan
Laser Materials Processing

Silicon Nitride Laser Cleaning Settings

When laser cleaning Silicon Nitride, watch its brittleness first—it cracks easily under sudden heat. I've seen that happen when folks push too hard right away. This works best if you start with gentle pulses to warm the surface slowly, building up over a few passes. That way, you remove contaminants without risking fractures, keeping the material's tough, heat-resistant nature intact. Just avoid high speeds early on.

Silicon Nitride Machine Settings

Power Range

100
W
1
100
120

Wavelength

1,064
nm
355
1,064
1.1e4

Spot Size

50
μm
0.1
50
500

Repetition Rate

50
kHz
1
50
200

Energy Density

5.1
J/cm²
0.1
5.1
20

Pulse Width

10
ns
0.1
10
1,000

Scan Speed

500
mm/s
10
500
5,000

Pass Count

3
passes
1
3
10

Overlap Ratio

50
%
10
50
90

Dwell Time

100
μs
0
100
200

Silicon Nitride Material Safety

Shows damage risk across parameter space. Green = safe, Red = damage danger.

DANGER
Fluence:101.86 J/cm²
From optimal:71%
Pulse Duration (ns)
1000
750
500
250
0
1
21
41
61
80
100
120
Power (W)

Silicon Nitride Energy Coupling

Shows laser energy transfer efficiency. Green = high coupling (energy absorbed), Red = poor coupling (energy reflected).

SUBOPTIMAL
Fluence: J/cm²
From optimal:46%
Pulse Duration (ns)
1000
750
500
250
0
1
21
41
61
80
100
120
Power (W)

Silicon Nitride Thermal Stress Risk

Shows thermal stress and distortion risk. Green = low stress risk, Red = high stress/warping/cracking risk.

HIGH RISK
Fluence: J/cm²
From optimal:63%
Pulse Duration (ns)
1000
750
500
250
0
1
21
41
61
80
100
120
Power (W)

Silicon Nitride Cleaning Efficiency

Shows cleaning performance across parameter space. Green = optimal effectiveness, Red = ineffective.

GOOD
Fluence:101.86 J/cm²
From optimal:33%
Pulse Duration (ns)
1000
750
500
250
0
1
21
41
61
80
100
120
Power (W)

Silicon Nitride Heat Buildup

See if your multi-pass cleaning will overheat and damage the material

Safe

Heat Safety

Heat Control

Cooling Efficiency

Pass Optimization

📈 Heat Profile

Safe (<150°C)
Damage (>250°C)
0°C100°C200°C300°C✓ Safe🚨 Damage20°CPass 1Pass 2Pass 3

🔧 Laser Settings

Pulse Energy:2000.00 mJ
Total Sim Time:90.6s

🌡️ Live Temperature

20°C
✅ Safe
Pass 1 of 3
Time: 0.0s / 90.6s

▶️ Simulation Controls

Diagnostic & Prevention Center

Proactive strategies and reactive solutions for silicon nitride

🌡️thermal management

Heat accumulation

Impact: Excessive heat can damage substrate or alter material properties

Solutions:

  • Reduce repetition rate
  • Increase scan speed
  • Add cooling time between passes

Prevention: Monitor surface temperature and adjust parameters accordingly

🔍surface characteristics

Variable surface roughness

Impact: Inconsistent cleaning results across different surface textures

Solutions:

  • Adjust energy density based on surface condition
  • Use multiple passes with progressive settings
  • Pre-characterize surface before cleaning

Prevention: Standardize surface preparation procedures

Silicon Nitride Dataset Download

License: Creative Commons BY 4.0 • Free to use with attribution •Learn more

Parameter Relationships

Shows how changing one parameter physically affects others. Click any node to see its downstream impacts and role.

PowerRangeWavelengthSpotSizeRepetitionRateEnergyDensityPulseWidthScanSpeedPassCountOverlapRatioDwellTime

Power Range

Amplifies damage risk in Pulse Width and Energy Density. Keep low to maintain safety margins.

Spot Size

Same power in a smaller spot creates much higher energy density.

Energy Density

Higher power delivers more energy per pulse, removing more material.

Pulse Width

More power means higher peak intensity. Too much can damage the material.

Pass Count

Using more passes means you can use lower power and still get the job done.