Lead Crystal surface undergoing laser cleaning showing precise contamination removal
Yi-Chun Lin
Yi-Chun LinPh.D.Taiwan
Laser Materials Processing

Lead Crystal Laser Cleaning Settings

When laser cleaning Lead Crystal, you'll want to start with its soft, lead-infused structure. This makes it more prone to surface damage than regular glass, so it absorbs heat unevenly and risks cracking under direct exposure. Use gentle, low-energy pulses to lift contaminants without etching the crystal's shine. Keep your scan slow and overlap lightly for even coverage. Always watch for clouding at the end, and pause to cool if it appears.

Lead Crystal Machine Settings

Power Range

25
W
1
25
120

Wavelength

1,064
nm
355
1,064
1.1e4

Spot Size

100
μm
0.1
100
500

Repetition Rate

20
kHz
1
20
200

Energy Density

2.5
J/cm²
0.1
2.5
20

Pulse Width

100
ns
0.1
100
1,000

Scan Speed

500
mm/s
10
500
5,000

Pass Count

2
passes
1
2
10

Overlap Ratio

50
%
10
50
90

Lead Crystal Material Safety

Shows damage risk across parameter space. Green = safe, Red = damage danger.

WARNING
Fluence:15.92 J/cm²
From optimal:54%
Pulse Duration (ns)
1000
750
500
250
0
1
21
41
61
80
100
120
Power (W)

Lead Crystal Energy Coupling

Shows laser energy transfer efficiency. Green = high coupling (energy absorbed), Red = poor coupling (energy reflected).

VERY POOR
Fluence: J/cm²
From optimal:71%
Pulse Duration (ns)
1000
750
500
250
0
1
21
41
61
80
100
120
Power (W)

Lead Crystal Thermal Stress Risk

Shows thermal stress and distortion risk. Green = low stress risk, Red = high stress/warping/cracking risk.

ELEVATED
Fluence: J/cm²
From optimal:46%
Pulse Duration (ns)
1000
750
500
250
0
1
21
41
61
80
100
120
Power (W)

Lead Crystal Cleaning Efficiency

Shows cleaning performance across parameter space. Green = optimal effectiveness, Red = ineffective.

MODERATE
Fluence:15.92 J/cm²
From optimal:38%
Pulse Duration (ns)
1000
750
500
250
0
1
21
41
61
80
100
120
Power (W)

Lead Crystal Heat Buildup

See if your multi-pass cleaning will overheat and damage the material

Excellent

Heat Safety

Heat Control

Cooling Efficiency

Pass Optimization

📈 Heat Profile

Safe (<150°C)
Damage (>250°C)
0°C100°C200°C300°C✓ Safe🚨 Damage20°CPass 1Pass 2

🔧 Laser Settings

Pulse Energy:1250.00 mJ
Total Sim Time:60.4s

🌡️ Live Temperature

20°C
✅ Safe
Pass 1 of 2
Time: 0.0s / 60.4s

▶️ Simulation Controls

Diagnostic & Prevention Center

Proactive strategies and reactive solutions for lead crystal

🌡️thermal management

Heat accumulation

Impact: Excessive heat can damage substrate or alter material properties

Solutions:

  • Reduce repetition rate
  • Increase scan speed
  • Add cooling time between passes

Prevention: Monitor surface temperature and adjust parameters accordingly

🔍surface characteristics

Variable surface roughness

Impact: Inconsistent cleaning results across different surface textures

Solutions:

  • Adjust energy density based on surface condition
  • Use multiple passes with progressive settings
  • Pre-characterize surface before cleaning

Prevention: Standardize surface preparation procedures

Lead Crystal Dataset Download

License: Creative Commons BY 4.0 • Free to use with attribution •Learn more

Parameter Relationships

Shows how changing one parameter physically affects others. Click any node to see its downstream impacts and role.

PowerRangeWavelengthSpotSizeRepetitionRateEnergyDensityPulseWidthScanSpeedPassCountOverlapRatio

Power Range

Amplifies damage risk in Pulse Width and Energy Density. Keep low to maintain safety margins.

Spot Size

Same power in a smaller spot creates much higher energy density.

Energy Density

Higher power delivers more energy per pulse, removing more material.

Pulse Width

More power means higher peak intensity. Too much can damage the material.

Pass Count

Using more passes means you can use lower power and still get the job done.