Copper surface undergoing laser cleaning showing precise contamination removal
Ikmanda Roswati
Ikmanda RoswatiPh.D.Indonesia
Ultrafast Laser Physics and Material Interactions

Copper Laser Cleaning Settings

When laser cleaning copper, we've found that starting with gentle pulses works best because its shiny surface bounces back most of the energy, so you get even coverage without wasting shots. This high reflectivity sets it apart from duller metals like iron, meaning we adjust our setup to focus on short, repeated passes that gradually lift dirt and oxides while the metal's strong heat-spreading ability prevents hot spots. But watch out midway—push too hard and the surface can soften unevenly, so we dial back intensity and overlap scans to keep things cool and restore that clean, conductive finish for electronics or plumbing jobs.

Copper Machine Settings

Power Range

100
W
1
100
120

Wavelength

1,064
nm
355
1,064
1.1e4

Spot Size

50
μm
0.1
50
500

Repetition Rate

100
kHz
1
100
200

Fluence Threshold

2.5
J/cm²
0.3
2.5
4.5

Pulse Width

10
ns
0.1
10
1,000

Scan Speed

500
mm/s
10
500
5,000

Pass Count

3
passes
1
3
10

Overlap Ratio

50
%
10
50
90

Copper Material Safety

Shows damage risk across parameter space. Green = safe, Red = damage danger.

DANGER
Fluence:50.93 J/cm²
From optimal:71%
Pulse Duration (ns)
1000
750
500
250
0
1
21
41
61
80
100
120
Power (W)

Copper Energy Coupling

Shows laser energy transfer efficiency. Green = high coupling (energy absorbed), Red = poor coupling (energy reflected).

SUBOPTIMAL
Fluence: J/cm²
From optimal:54%
Pulse Duration (ns)
1000
750
500
250
0
1
21
41
61
80
100
120
Power (W)

Copper Thermal Stress Risk

Shows thermal stress and distortion risk. Green = low stress risk, Red = high stress/warping/cracking risk.

ELEVATED
Fluence: J/cm²
From optimal:46%
Pulse Duration (ns)
1000
750
500
250
0
1
21
41
61
80
100
120
Power (W)

Copper Cleaning Efficiency

Shows cleaning performance across parameter space. Green = optimal effectiveness, Red = ineffective.

GOOD
Fluence:50.93 J/cm²
From optimal:33%
Pulse Duration (ns)
1000
750
500
250
0
1
21
41
61
80
100
120
Power (W)

Copper Heat Buildup

See if your multi-pass cleaning will overheat and damage the material

Safe

Heat Safety

Heat Control

Cooling Efficiency

Pass Optimization

📈 Heat Profile

Safe (<150°C)
Damage (>250°C)
0°C100°C200°C300°C✓ Safe🚨 Damage20°CPass 1Pass 2Pass 3

🔧 Laser Settings

Pulse Energy:1000.00 mJ
Total Sim Time:90.6s

🌡️ Live Temperature

20°C
✅ Safe
Pass 1 of 3
Time: 0.0s / 90.6s

▶️ Simulation Controls

Diagnostic & Prevention Center

Proactive strategies and reactive solutions for copper

🌡️thermal management

Heat accumulation

Impact: Excessive heat can damage substrate or alter material properties

Solutions:

  • Reduce repetition rate
  • Increase scan speed
  • Add cooling time between passes

Prevention: Monitor surface temperature and adjust parameters accordingly

🔍surface characteristics

Variable surface roughness

Impact: Inconsistent cleaning results across different surface textures

Solutions:

  • Adjust energy density based on surface condition
  • Use multiple passes with progressive settings
  • Pre-characterize surface before cleaning

Prevention: Standardize surface preparation procedures

Copper Dataset Download

License: Creative Commons BY 4.0 • Free to use with attribution •Learn more

Parameter Relationships

Shows how changing one parameter physically affects others. Click any node to see its downstream impacts and role.

PowerRangeWavelengthSpotSizeRepetitionRateFluenceThresholdPulseWidthScanSpeedPassCountOverlapRatio

Power Range

Amplifies damage risk in Pulse Width. Keep low to maintain safety margins.

Spot Size

Same power in a smaller spot creates much higher energy density.

Pulse Width

More power means higher peak intensity. Too much can damage the material.

Pass Count

Using more passes means you can use lower power and still get the job done.