Regime 3 — Thermal Decontamination
CW or high-frequency pulsed beam heats and volatilizes organic contamination. Substrate reaches elevated temperatures — unsuitable for heat-sensitive materials. High area rate.
Thermal decontamination uses laser-induced heating to decompose or oxidize organic contamination at the substrate surface without ablating the substrate itself. Rather than exceeding the material's ablation threshold, the process operates below it — laser fluence heats the surface to the decomposition temperature of the organic layer (typically 300–600°C for oils, lubricants, and biological films) while the substrate temperature remains below its damage threshold.
This is the dominant mechanism for cleaning lightly contaminated food-contact surfaces, optical components, and precision metal parts where any material removal is unacceptable. The practical limitation is selectivity: if the substrate and contamination have similar thermal properties, the operating window narrows and real-time temperature monitoring becomes necessary.
Suitable Architectures
No pulse width or frequency parameter. Steady emission. Cleaning is entirely thermal. High area rates; significant substrate heating risk.
Compatible Systems
Complete laser cleaning systems whose architecture supports this regime.
| Model | |
|---|---|
CL1000 | → |
CL2000 | → |
CL1000 | → |
HC-D | → |

