Laser Cleaning Parameters
Open reference database: machine specifications, derived parameter calculator, and ablation threshold data for major contaminant–substrate pairs. Architecture-neutral — covers all manufacturers equally.
Cleaning Regimes
Four distinct ablation mechanisms. Each page lists compatible machines and relevant threshold data.
Regime 1 — Sublimation Ablation
Contaminant vaporizes directly without significant thermal diffusion into substrate. Requires short pulses (ns) or ultrashort pulses. Primary mechanism for rust, hard oxides, coatings.
Regime 2 — Interfacial Detachment
Pressure wave at the coating-substrate interface physically delaminate the coating. High pulse energy is critical. Preferred for thick coatings and paint removal where low fluence passes would ablate top surface only.
Regime 3 — Thermal Decontamination
CW or high-frequency pulsed beam heats and volatilizes organic contamination. Substrate reaches elevated temperatures — unsuitable for heat-sensitive materials. High area rate.
Regime 4 — Photomechanical
Ultrashort pulse (ps/fs). Ablation is athermal — minimal heat affected zone. Required for narrow-window substrates, heritage conservation, and microelectronics.
Values sourced from manufacturer datasheets and peer-reviewed literature; not Z-Beam service specifications.
Last updated: July 2026.