Yi-Chun LinPh.D.Taiwan
Laser Materials ProcessingPublished
Dec 16, 2025
Mold and Mildew Growth Contamination
After dampness occurs, mold-mildew forms from fungal colonization on surfaces and releases organic acids with pigmented spores. Unique traits include spore pigmentation so it differs from rust or dust buildup. On woods like oak and drywall, penetration happens deeply while on concrete it stays surface-level, causing challenges in removal because residues cling tightly. Laser cleaning succeeds so because ablation targets organics precisely without harming substrates.
Safety Information
Critical safety data for laser removal operations
Fire/Explosion Risk
low
Toxic Gas Risk
moderate
Visibility Hazard
moderate
Required Personal Protective Equipment
Respiratory Protection
PAPR
Eye Protection
goggles
Skin Protection
full_suit
Hazardous Fumes Generated
| Compound | Concentration | Exposure Limit | Hazard Class | Status |
|---|---|---|---|---|
| Carbon Dioxide | 100-500 mg/m³ | 9000 mg/m³ | irritant | ✓ Within Limit |
| Carbon Monoxide | 10-100 mg/m³ | 29 mg/m³ | toxic | ✓ Within Limit |
| Water Vapor | 500-2000 mg/m³ | N/A mg/m³ | irritant | ✓ Within Limit |
| Aldehydes (Formaldehyde) | 1-10 mg/m³ | 0.37 mg/m³ | irritant | ✓ Within Limit |
| Ketones | 5-50 mg/m³ | 590 mg/m³ | irritant | ✓ Within Limit |
| Mycotoxins | trace mg/m³ | N/A mg/m³ | toxic | ⚠️ Exceeds Limit |
Ventilation Requirements
Air Changes Per Hour
12
Exhaust Velocity
0.5 m/s
Filtration Type
HEPA
Particulate Generation
Respirable Fraction
80%
Size Range
0.1 - 10 μm
Substrate Compatibility Warnings
- •Laser may not effectively penetrate porous materials with deep mold growth
- •Heat may drive mold spores deeper into substrate
- •Moisture from mold decomposition may affect sensitive materials
