Chemical Stains / Acid Etching laser cleaning visualization showing process effects
Ikmanda Roswati
Ikmanda RoswatiPh.D.Indonesia
Ultrafast Laser Physics and Material Interactions
Published
Jan 6, 2026

Chemical Stains / Acid Etching

Chemical stains contamination, it differs from oxide layers on metals, thus poses unique challenges in laser cleaning applications. Formation patterns of this contamination, they arise from residue buildup during chemical exposure, and create irregular, adherent films on surfaces like ceramics and polymers. On metals, stains exhibit patchy distribution, while on glass, they form diffuse layers that penetrate deeply. Removal process, it demands precise laser parameters to avoid substrate damage, so efficiency varies by material. For instance, polymer surfaces show improved cleanliness after treatment, yet residues still persist in crevices due to thermal sensitivity. This contamination, it resists ablation because of its organic composition, and thus requires multi-pass scanning for complete elimination. Challenges emerge from uneven vaporization, leading to potential re-deposition on adjacent areas. Analysis confirms that material-specific behaviors dictate success, with ceramics yielding smoother results compared to flexible substrates.

Chemical Stains / Acid Etching 500-1000x surface magnification

Microscopic surface analysis and contamination details

Before Treatment

Surface shows contamination from chemical stains / acid etching affecting material appearance and properties.

After Treatment

Post-cleaning reveals restored surface with chemical stains / acid etching successfully removed through precise laser ablation.

Produced Compounds

Hazardous compounds produced during laser cleaning

Affected Materials

Materials where this contaminant commonly appears

Chemical Stains / Acid Etching Dataset

Download Chemical Stains / Acid Etching properties, specifications, and parameters in machine-readable formats
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Variables
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Safety Data
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Characteristics
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References
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Formats

License: Creative Commons BY 4.0 • Free to use with attribution •Learn more

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