PCB Oil Contamination

Contamination on PCBs forms during soldering process and handling. Residues like flux and oils stick to copper traces and boards. After exposure, layer builds unevenly because board topography traps particles. So, patterns show clusters around joints.

Removal challenges arise from sensitivity of electronics. Laser cleaning targets residues selectively, but heat affects underlying materials. On FR4 substrate, process removes buildup without damaging insulation. Metal parts exhibit stronger adhesion, so higher energy risks etching.

In applications, treatment achieves clean surfaces effectively. Buildup is observed in crevices, and cleaning applies short pulses to avoid warping. Results are obtained from scans showing uniform finish after process. Surface exhibits reduced residue during inspections.