Copper Electroplating

Copper-plating contamination, it arises during electroplating processes, where copper layers deposit unevenly on metallic substrates, influenced from humidity and substrate roughness. This contamination manifests as thin, adherent films that exhibit tenacious bonding, particularly on steel or aluminum surfaces, which leads to irregular patterns resembling dendritic growths. In laser cleaning applications, the removal challenges become evident, as the contamination persists under pulsed irradiation, demanding higher fluence to dislodge it without substrate damage. It appears that material-specific behaviors vary; on ferrous alloys, the layer delaminates readily, yet on non-ferrous bases, adhesion strengthens, complicating ablation. The process yields cleaner surfaces, that demonstrates effectiveness in restoring conductivity, though residual pitting often remains. Shows promise for industrial use, where precise control mitigates recontamination risks.