Copper Electroplating Contamination

Copper-plating contamination, it manifests as a thin metallic layer from electroplating processes or corrosion, which adheres tenaciously to substrates like steel and brass, yet peels more readily on plastics such as ABS. This pattern, distinguished by its conductive sheen and uniform spread unlike irregular oxide deposits, poses challenges in removal due to potential substrate pitting that seems dependent from laser intensity. Laser cleaning proves effective, as the contamination absorbs energy selectively, leading to precise ablation without excessive heat spread.