Electroplating Solution Residue Contamination

Electroplating-residue contamination, it arises from chemical deposits in bath solutions during the plating process, and forms thin adherent layers on metal surfaces. This residue, it distinguishes by crystalline structure and chemical inertness from oxide scales or dust particles; on steel it embrittles surface, on brass it corrodes selectively, while on copper it conducts poorly and still persists stubbornly, so strong bonding resists mechanical removal. Laser cleaning ablates residue precisely with pulsed energy, without damaging substrate, and thus restores conductivity already.