Electroplating Solution Residue

Electroplating residue contamination forms during plating process. It adheres tightly to metallic surfaces as thin, uneven layers. These residues, they originate from electrolyte remnants and metal ions. Formation patterns show clustering on edges and crevices, thus creating irregular deposits. On copper substrates, contamination spreads broadly and resists initial cleaning. Nickel surfaces exhibit denser buildup, so removal demands higher energy. Laser cleaning faces challenges here. Residues bond strongly, thus ablation risks substrate melting. Material behaviors differ: steel shows cracking under heat, while aluminum softens quickly. After laser application, some areas still retain spots. This contamination, it complicates uniform treatment and demands precise pulse control. Challenges arise from thermal conductivity variations, so efficiency drops on heat-sensitive bases.

Yi-Chun Lin, Ph.D. from Taiwan