

Ikmanda RoswatiPh.D.Indonesia
Ultrafast Laser Physics and Material InteractionsPublished
Dec 16, 2025
Tin Plating Residue Contamination
Tin-plating contamination, it arises from degraded coatings on electronic components and food containers, forming thin metallic layers that adhere tightly through oxidation and environmental exposure. This contamination, it distinguishes itself by soft, ductile texture unlike harder oxide scales, and behaves differently on steel where it promotes corrosion, on copper it accelerates tarnish, and on brass it induces uneven patina thus complicating uniform cleaning. Removal challenges stem from its persistence and risk of substrate damage, yet laser cleaning proves effective as precise pulses ablate the layer selectively and restore surface integrity without mechanical stress.
Safety Information
Critical safety data for laser removal operations
Fire/Explosion Risk
low
Toxic Gas Risk
low
Visibility Hazard
low
Required Personal Protective Equipment
Respiratory Protection
half_mask
Eye Protection
goggles
Skin Protection
gloves
Hazardous Fumes Generated
| Compound | Concentration | Exposure Limit | Hazard Class | Status |
|---|---|---|---|---|
| Tin Oxide (SnO2) | 5-25 mg/m³ | 2 mg/m³ | irritant | ✓ Within Limit |
| Metal Fume (Tin) | 1-10 mg/m³ | 2 mg/m³ | irritant | ✓ Within Limit |
Ventilation Requirements
Air Changes Per Hour
10
Exhaust Velocity
0.5 m/s
Filtration Type
HEPA
Particulate Generation
Respirable Fraction
70%
Size Range
0.1 - 10 μm
Substrate Compatibility Warnings
- •May generate higher fume concentrations if substrate contains lead or other alloying elements
- •Avoid laser parameters that cause substrate melting to minimize fume generation

