Anti-Seize Compound

Anti-seize contamination forms as sticky organic residue on metal surfaces during assembly processes. Before laser cleaning, layer adheres tightly because compounds include graphite and metals, so removal challenges increase. Contamination exhibits uneven patterns, thicker at joints and thinner on flat areas. In observations, residue resists initial pulses due to heat absorption, and buildup persists on aluminum more than steel. After treatment, surface shows partial carbon traces, so multiple passes achieve cleaner results. Process removes organic parts effectively, but metallic remnants demand adjusted energy. Material behaviors differ; residue on copper conducts heat quickly, leading to deeper penetration during exposure. Challenges arise from residue melting instead of vaporizing, so careful intervals prevent substrate damage. These patterns highlight need for tailored laser settings in industrial applications.

Ikmanda Roswati, Ph.D.
Indonesia