Thermal Compound Deposits

Thermal paste contamination forms during heat transfer applications. Paste spreads thinly on surfaces and adheres strongly because of its viscous nature. After exposure to heat, residue hardens, so unique patterns emerge like uneven layers on metals. On aluminum, contamination shows patchy buildup, while on copper, it creates smooth films.

Removal challenges arise from this adhesion. Laser cleaning targets organic residue, but paste resists ablation because it embeds deeply. During treatment, surface is cleaned gradually, and multiple passes achieve better results. Material-specific behaviors differ; steel surfaces exhibit cracking under laser, so careful energy control prevents damage. In observations, process removes contamination effectively without harming substrate. Analysis is performed on samples to confirm uniformity after cleaning.