Thermal Compound Deposits Contamination

Thermal paste contamination arises from silicone or metal-based materials used in CPU cooling systems and it forms when paste spreads beyond interfaces during assembly or operation. This contaminant shows unique greasy texture and strong adhesion so it differs from dry dust or oxide layers by resisting simple wiping. On copper and aluminum surfaces, it hardens over time and removal challenges include residue buildup because paste bonds tightly. Laser cleaning works effectively since pulses vaporize paste without harming underlying nickel-plated areas.